- 120 µm travel in Z (±60 µm)
- Tip / tilt range of ± 50 µrad
- Load capacity up to 8 kg
- Customer selectable presets optimized for specific load requirements
WP120B Low Profile Tip and Tilt Stage for 300 mm Wafers
The WP120B is Queensgate’s most accurate wafer positioning stage.
It uses a parallel-kinematic tripod design to achieve sample leveling of ±50 µrad, while achieving milisecond step-and-settle times over the 120 µm closed-loop Z range.
Sub-nanometer-resolution capacitive displacement sensors directly measuring the moving platform, flexure guidance, and high-bandwidth closed-loop control provide exceptional flatness whilst scanning, with pitch and roll errors of less than 2 µrads.
The stage is designed to hold 300 mm wafers, with load capacity up to 8 kg, through-holes allow access for wafer lift-pin systems.
It is compatible with Prior’s ProScan H112 Large Format XY Stage, which offers a full 300 x 300 mm travel range for wafer inspection and defect detection.
WP120B Low Profile Tip and Tilt Stage for 300 mm Wafers
The WP120B is Queensgate’s most accurate wafer positioning stage.
It uses a parallel-kinematic tripod design to achieve sample leveling of ±50 µrad, while achieving milisecond step-and-settle times over the 120 µm closed-loop Z range.
Sub-nanometer-resolution capacitive displacement sensors directly measuring the moving platform, flexure guidance, and high-bandwidth closed-loop control provide exceptional flatness whilst scanning, with pitch and roll errors of less than 2 µrads.
The stage is designed to hold 300 mm wafers, with load capacity up to 8 kg, through-holes allow access for wafer lift-pin systems.
It is compatible with Prior’s ProScan H112 Large Format XY Stage, which offers a full 300 x 300 mm travel range for wafer inspection and defect detection.
| Axis | Z, Tip-Tilt |
| Open Loop Range (Z) | 140 µm |
| Closed Loop Range (Z) | 120 µm |
| Closed Loop Range (Tip Tilt) | 100 µrad |
| Resonant Frequency at 0 kg | 5.2 kg | 8 kg | 320 Hz | 190 Hz | 155 Hz |
| Linearity Error (Z) | Min: 0.06%, Max: 0.15% |
| Linearity Error (Tip-Tilt) | Min: 0.06%, Max: 0.15% |
| Roll Pitch Yaw | 2 µrad (while commanding Z axis only) |
| Step Settle (1 µm) | 9 ms |
| Repeatability, 60 µm step | 5.5 nm |
| Material | Aluminum |
| Stage mass (excluding cables) | 5.8 kg |
| Size (L x W x H) | 375 x 375 x 30 mm |
- Wafer inspection / defect detection
- Electron microscopy (SEM/TEM)
- Interferometry and metrology
- Bonding technology
- Surface structuring
- Wafer probing and chip verification
